April 27, 2022 – SPIE invited paper, V. Moroz, X.-W. Lin, A. Svizhenko, P. Stopford, J. Huang, L. S. Melvin III, K. Ramkumar, R. Hentschke, K. Taravade, and S. Jones, “Material-Guided Patterning for Stacked Transistor Technologies,” SPIE Advanced Lithography Conference (2022). Contact SPIE to get access.
April 15, 2022 – The Lost Opportunity for 450mm – the semiconductor industry is expected to double in the next 10 to 12 years, 450mm would have made that much easier but is now a lost opportunity.
December 13, 2021 – IEDM invited paper, X.-W. Lin, V. Moroz, X. Xu, Y. Gao, D. Rennie, P. Asenov, S. Smidstrup, D. Sherlekar, Z. Qin, T. Fang, J. Lee, M. Choi, and S. Jones, “Heterogeneous Integration Enabled by the State-of-the-Art 3DIC and CMOS Technologies: Design, Cost, and Modeling,” IEDM (2021). Contact the IEEE to get a copy of the paper.
October 13, 2021 – TSMC Arizona fab cost revisited – an analysis of the cost for TSMC to operate a fab in Arizona versus their fabs in Taiwan.
September 29, 2021 – SISPAD paper and Keynote address, Scotten W. Jones,” Cost Simulations to Enable PPAC Aware Technology Development” SISPAD (2021). Contact the IEEE to get a copy of the paper.
July 27, 2021 – Intel Accelerated – an analysis of Intel’s Intel Accelerated announcement.
July 10, 2021 – SPCC Conference paper, Scotten W. Jones, “The Evolution of Leading Edge Technology and the Impact on Cleans,” SPCC (2021). Paper is available to attendees only.
April 8, 2021 – SPIE 2021 – Applied Materials – DRAM Scaling – a discussion of Applied Materials paper from the SPIE Advanced Lithography Conference in February, on DRAM scaling.
March 24, 2021 – Intel’s IDM 2.0 – an analysis of Intel’s issues over the last several years and the IDM 2.0 announcement from the company.
March 17, 2021 – SPIE 2021 – ASML DUV and EUV Updates – at the SPIE Advanced Lithography Conference in February, ASML gave an update on their latest DUV and EUV systems, this article summarizes the presentations.
February 15, 2021 – Intel Node Names – an analysis of how Intel nodes compare to TSMC nodes and a proposed method for renaming Intel nodes to match TSMC’s nodes.
January 8, 2021 – IEDM 2021 – Imec Plenary Talk – a summary of Imec’s very informative plenary talk at IEDM in December 2020, on the current status and future of leading edge semiconductor technology.
December 15, 2020 – IEDM invited paper, V. Moroz, X.-W. Lin, P. Asenov, D. Sherlekar, M. Choi, L. Sponton, L. S. Melvin III, J. Lee, B. Cheng, A. Nannipieri, J. Huang, and S. Jones, “DTCO Launches Moore’s Law Over the Feature Scaling Wall,” IEDM (2020). Contact the IEEE to get a copy of the paper.
December 2, 2020 – No Intel and Samsung are not passing TSMC – a comparison of Intel, Samsung and TSMC from 14nm down to 3nm. This is in answer to a recent misleading post from Seeking Alpha.
July 27, 2020 – VLSI Symposium 2020 – Imec Buried Power Rail – at the 2020 VLSI Technology Symposium Imec presented on Buried Power Rails and this article summarizes that paper.
June 25, 2020 – Key Semiconductor Conferences Go Virtual – the 2020 Symposium on VLSI Technology and Circuits went virtual last week and IEDM will be virtual in December. In this article we discuss what the virtual conference experience is like.
May 25, 2020 – Effect of Design on Transistor Density – how design decisions effect transistor density and why you can’t compare transistor density on products to draw conclusions about processes.
March 4, 2020 – LithoVision – Economics in the 3D Era – LithoVision was canceled this year but I had already finished my presentation, this is a write up of the presentation I had planned to give.
January 20, 2021 – IEDM 2019 – Imec – interviews with 3 Imec researchers with a general discussion of the status of memory and then specific discussions of five papers Imec presented.
January 8, 2020 – IEDM 2019 – IBM and Leti – a summary of horizontal nanosheet papers presented by IBM and Leti at IEDM.
December 16, 2019 – IEDM 2019 – TSMC 5nm Process – an analysis of TSMC’s 5nm paper at IEDM with a summary of what they disclosed as well as the results of our own investigation into the process.
August 9, 2019 – 300mm Fab Watch 2019!– an article from Daniel Nenni of SemiWiki discussing our 300mm Watch product.
July 30, 2019 – SEMICON West 2019 – Day 3 – GLOBALFOUNDRIES – on the third day of Semicon I got to sit down with Gary Patton the CTO of GLOBALFOUNDRIES and get an update on the company.
July 19, 2019 – SEMICON West 2019 – Day 2 – a write up of the second day of Semicon West with a focus on an Applied Materials announcement and joint Leti-Fraunhofer press conference.
April 30, 2018 – Intel 10nm Yield Issues – a discussion of Intel’s recent disclosure that they are pushing out 10nm volume production to 2019 due to yield issues.
March 12, 2018 – Leading Edge Logic Landscape 2018 – a comparison of the leading edge logic technologies from GLOBALFOUNDRIES, Intel, Samsung and TSMC.
October 20, 2017 – GLOBALFOUNDRIES RF Leadership – a detailed review of the requirements for various RF applications and GLOBALFOUNDRIES extensive set of RF focused process options.
October 20, 2017 – IEDM 2017 Preview – a preview of the upcoming IEDM conference.
July 21, 2017 – SEMICON West – The FDSOI Ecosystem – a discussion of the FDSOI Ecosystem including information from interviews and presentations at SEMICON West.
July 15, 2017 – Standard Node Trend – an analysis of how node names compare to a variety of physical features.
June 9, 2017 – Samsung Details Foundry Roadmap – an article covering the details of Samsung’s recently announced foundry roadmap.
April 19, 2017 – SPIE 2017 – ASML Interview and Presentations – An article summarizing ASML’s presentations at the SPIE Advanced Lithography Conference plus and interview with Mike Lercel of ASML at the same conference.
February 7, 2017 – Scott Jones ISS Talk – Moore’s Law Lives – At ISS 2017 our president Scotten W. Jones gave a talk on advanced logic. This article summarizes that talk.
December 21, 2016 – IEDM 2016 – Marie Semeria LETI Interview – an interview with Leti CEO Marie Semeria covering developments in FDSOI and Horizontal nanowires.
December 17, 2016 – IEDM 2016 – 7nm Shootout – a comparison and analysis of the TSMC and Global Alliance 7nm presented at IEDM 2016.
September 26, 2016 – The Status and Future of FDSOI – a comparison of FDSOI processes by company and year and how they compare to FinFET processes.
September 19, 2016 – GLOBALFOUNDRIES Extends the FDSOI Roadmap – a discussion of GLOBALFOUNDRIES recent 12nm FDSOI announcement including an interview with Greg Bartlett, GF Senior Vice President for the CMOS Business Unit .
December 16, 2015 – 3D NAND Challenges and Opportunities – a webinar on 3D NAND that we participated in. The webinar was held by Solid State Technology Magazine and sponsored by Air Products.
December 16, 2015 – Why Did Apple Buy a Fab – a discussion of what Apple might do with the wafer fab they recently purchased.
December 16, 2015 – IEDM Blog’s – Part 2 – Memory Short Course – the second in a series of articles about IEDM 2015. a summary of the memory short curse held on Sunday at IEDM.
December 11, 2015 – IEDM 2015 Blog’s – Part 1 – Overview – the first in a series of articles about IEDM 2015. This article is a summary of what we saw and sets the stage for the following articles.
December 1, 2015 – Samsung Versus Intel at 14nm – a comparison of the back end pitches and lithography technologies for Intel’s and Samsung’s 14nm process.
October 26, 2015 – Global Foundries 14nm Process Update – we have published a blog summarizing a conference call we had with Global Foundries on their 14nm process.
October 9, 2015 – IMEC and Cadence Disclose 5nm Test Chip – we have published an article summarizing a conference call we had with IMEC and Cadence abut their 5nm test chip.
September 9, 2015 – 3D Xpoint and the Future of Memory – we have published an analysis of the recent Intel/Micron 3D Xpoint memory disclosure.
July 11, 2015 – Who Needs to Lead at 14, 10 and 7nm nodes – we have published an article discussing the IBM 7nm announcement and what it really means for the leading logic companies.
July 7, 2015 – SEMICON West Preview – we have published an article discussing what we expect to see at SEMICON West.
February 20, 2015 – SPIE Advanced Lithography Preview – we have published a discussion of what we are looking forward to at the upcoming SPIE Advanced Lithography Conference.
January 28, 2015 – Translating Intel – we have published a discussion of Intel’s usage of multi patterning and air gaps.
January 7, 2015 – Ion Implant – Its Not Just for Doping Anymore – we have published a discussion of the emerging usage of ion implantation for material modification in integrated circuit fabrication.
January 6, 2015 – Apples Versus Zebras – we have published a discussion of process density comparisons we have seen others make comparing Intel’s 14nm process to TSMC’s 20nm process.
July 10, 2014 – Silicon 2020 – 2014 update – an analysis of the Silicon Market in 2002 that we presented to the Silicon Materials Group at Semicon West.
October 2011 – IC Knowledge President Scotten W. Jones has published a short article in Advanced Substrate News on cost competitiveness of FDSOI for 22nm/20nm logic use. The article is available here.
July 2011 – FDSOI More Cost Effective for 22nm – IC Knowledge has completed a study for Soitec comparing Fully Depleted SOI (FDSOI) to bulk silicon at 22nm for System On A Chip (SOC) applications. The FDSOI Versus Bulk study found that FDSOI is the more cost effective solution. This study was completed and released in July of 2011.